Process Perfection for LoaC Mass Production
Leonhard Schwab, CTO, Dr Schwab Inspection Technology GmbH
Well-developed miniaturization technologies from semiconductor, data storage or MEMs are increasingly adapted for microfluidics and Lab-on-a-Chip fabrication as compact diagnostic tools with integrated functionality. Basis for most fabrication processes is photolithography combined with electro plating, injection molding, coating or bonding. Since they achieved in the meantime a reasonable degree of standardization they are predestinated for mass production, which is the key for cost effective disposable chips. At the same time, this is also the challenge because of the many steps with tight tolerances. Automated quality and process control of all steps and full surface is inevitable. In cooperation with leading format designers and chip manufacturers dr.schwab has developed an automated inspection platform “FPI-msd” for the quality and process optimization of such micro-structured devices. The FPI-msd system combines highly sensitive CCD-cameras with resolution down to µm for dimensional analysis of the corresponding structures and precise local defect detection with adaptable sensitivity to individual areas on the chip. It can be combined with measurement tasks for layer thickness, optical density or grating analysis. It is adjustable for all formats and allows full surface analysis with adapted sensitivity to individual inspection areas. The inspection is performed within the cycle time of production so that it can be used inline or off-line in basically all manufacturing steps. Process monitoring and statistics is performed to early recognize systematic malfunctions and to trace them back to the corresponding process step allowing timely correction and optimization, basis for a reliable and cost effective mass production.
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