Abstract

Integration Technologies for Next-Generation Microfluidic Devices

Bernd Dielacher, Business Development Manager, EV Group (EVG)

As Lab-on-a-Chip devices are increasingly getting more complex including components of different form factors and materials, thus advanced and scalable integration processes are required. As a market leading supplier of wafer bonding and nanoimprint lithography (NIL) equipment, we will demonstrate how these technologies are applied to microfluidics chips. We will discuss processes for hybrid integration schemes such as CMOS integration and will show how NIL can be used to integrate on-chip optical bio-sensing by nanometer-scale resolution patterns.