| Conferences \ Lab-on-a-Chip & Microfluidics World Congress 2017 \ Lab-on-a-Chip and Microfluidics: Companies, Technologies and Commercialization \ Agenda \ Bernd Dielacher |
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Industrial Implementation of Imprint and Bonding Technology for Lab-on-a-Chip DevicesTuesday, 3 October 2017 at 16:45  Add to Calendar ▼2017-10-03 16:45:002017-10-03 17:45:00Europe/LondonIndustrial Implementation of Imprint and Bonding Technology for Lab-on-a-Chip DevicesSELECTBIOenquiries@selectbiosciences.comTo successfully commercialize modern chip-based biotechnology devices in a fast growing market with stringent requirements and high regulatory hurdles, precise and cost-effective micro- and nano-structuring technologies are essential. Nanoimprint lithography (NIL), such as hot embossing and UV-NIL, has evolved from a niche technology to a powerful high-volume manufacturing method that is able to serve today’s needs and overcome the challenges of increasing complexity of microfluidic and lab-on-a-chip devices. This presentation will discuss NIL as a cost-effective large-area industrial structuring technology for lab-on-a-chip devices as well as corresponding bonding processes for device sealing. |
Add to Calendar ▼2017-10-02 00:00:002017-10-04 00:00:00Europe/LondonLab-on-a-Chip and Microfluidics: Companies, Technologies and CommercializationSELECTBIOenquiries@selectbiosciences.com
